Specific Process Knowledge/Thin film deposition: Difference between revisions
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*[[/Deposition of Silicon Oxide|Silicon Oxide]] | *[[/Deposition of Silicon Oxide|Silicon Oxide]] | ||
*[[/Deposition of Titanium Oxide|Titanium Oxide]] | *[[/Deposition of Titanium Oxide|Titanium Oxide]] | ||
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* | *Silicium | ||
* | | | ||
*[[/Deposition of Aluminium|13 Al Aluminium]] | |||
*[[/Deposition of Titanium|22 Ti Titanium]] | |||
*[[/Deposition of Chromium|24 Cr Chromium]] | |||
*[[/Deposition of Nickel|28 Ni Nickel]] | |||
*[[/Deposition of Copper|29 Cu Copper]] | |||
*[[/Deposition of Germanium|32 Ge Germanium]] | |||
*[[/Deposition of Molybdenum|42 Mo Molybdenum]] | |||
*[[/Deposition of Palladium|46 Pd Palladium]] | |||
*[[/Deposition of Silver|47 Ag Silver]] | |||
*[[/Deposition of Tin|50 Sn Tin]] | |||
*[[/Deposition of Tantalum|73 Ta Tantalum]] | |||
*[[/Deposition of Tungsten|74 W Tungsten]] | |||
*[[/Deposition of Platinum|78 Pt Platinum]] | |||
*[[/Deposition of Gold|79 Au Gold]] | |||
| | | | ||
*[[/Deposition of TiW|TiW]] alloy (10%/90% by weight) | *[[/Deposition of TiW|TiW]] alloy (10%/90% by weight) | ||