Revision as of 13:47, 14 October 2013

3rd Level - Material/Methode

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Choose material to deposit

Alcatel - E-beam evaporator and sputter tool
Lesker - Sputter tool
PVD co-sputter/evaporation - E-beam evaporator and multiple wafer tool
Wordentec - E-beam evaporator, sputter and thermal evaporator
Physimeca - E-beam evaporator (III-V lab)
IBE/IBSD Ionfab 300 - Sputter deposition of high quality optical layers and milling/etching
Hummer - Gold sputtering system
PECVD - Plasma Enhanced Chemical Vapor deposition
Furnace LPCVD Nitride (4" and 6") - Deposition of silicon nitride
Furnace LPCVD Polysilicon (4" and 6") - Deposition of polysilicon
Furnace LPCVD TEOS (4") - Deposition of silicon oxide
MVD - Molecular Vapor Deposition
Black Magic PECVD - Black Magic PECVD (Carbon)
Electroplating-Ni - Electrochemical deposition of nickel

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 =  Section under construction [[Image:section under construction.jpg|70px]] =
+{| {{table}}
+| align="center" style="background:#f0f0f0;"|''' Parameters'''
+| align="center" style="background:#f0f0f0;"|''' Units '''
+|-
+| Temperature||deg C||
+|-
+| Pressure ||mbar||
+|-
+| Flow ||sccm||
+|-
+|
+|}