Specific Process Knowledge/Thin film deposition/Deposition of TiW: Difference between revisions
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Deposition of TiW alloy can take place in the Wordentec. '''Observe:''' ''right now we don´t have a TiW target for Wordentec, please contact thinfilm@danchip.dtu.dk if you are interested in depositing TiW.'' | Deposition of TiW alloy can take place in the Wordentec. '''Observe:''' ''right now we don´t have a TiW target for Wordentec, please contact thinfilm@danchip.dtu.dk if you are interested in depositing TiW.'' | ||
{| border="1" cellspacing="0" cellpadding="4" | {| border="1" cellspacing="0" cellpadding="4" | ||
|-style="background:silver; color:black" | |||
| | |||
! Sputter deposition (Wordentec) | ! Sputter deposition (Wordentec) | ||
|- | |-style="background:WhiteSmoke; color:black" | ||
| Batch size | | Batch size | ||
| | | | ||
| Line 14: | Line 17: | ||
*6x4" wafers or | *6x4" wafers or | ||
*6x6" wafers | *6x6" wafers | ||
|- | |||
|-style="background:LightGrey; color:black" | |||
| Pre-clean | | Pre-clean | ||
|RF Ar clean | |RF Ar clean | ||
|- | |-style="background:WhiteSmoke; color:black" | ||
| Layer thickness | | Layer thickness | ||
|. | |. | ||
|- | |-style="background:LightGrey; color:black" | ||
| Deposition rate | | Deposition rate | ||
|Depending on process parameters, see [[/Sputtering of TiW in Wordentec|here.]] | |Depending on process parameters, see [[/Sputtering of TiW in Wordentec|here.]] | ||