Specific Process Knowledge/Etch: Difference between revisions

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 *[[/Wet Gold Etch|Wet Gold Etch]]
 *[[/Wet Platinum Etch|Wet Platinum Etch]]
+=  Section under construction [[Image:section under construction.jpg|70px]] =
+{| {{table}}
+| align="left" valign="top"  style="background:LightGray"|''' Dielectrica'''
+| align="left" valign="top" style="background:#DCDCDC;"|''' Semicondutors'''
+| align="left" valign="top" style="background:LightGray"|''' Metals'''
+| align="left" valign="top" style="background:#DCDCDC;"|''' Alloys'''
+| align="left" valign="top" style="background:LightGray"|''' Polymers'''
+|-valign="top"
+|style="background: LightGray"|
+[[/Deposition of Silicon Nitride|Silicon Nitride]] - ''and oxynitride'' <br/>
+[[/Deposition of Silicon Oxide|Silicon Oxide]]<br/>
+[[/Deposition of Titanium Oxide|Titanium Oxide]]<br/>
+|style="background: #DCDCDC"|
+[[/Deposition of Silicon|Silicon]]
+|style="background: LightGray"|
+[[/Deposition of Aluminium|Aluminium]] <br/>
+[[/Deposition of Titanium|Titanium]]<br/>
+[[/Deposition of Chromium|Chromium]]<br/>
+[[/Deposition of Nickel|Nickel]]<br/>
+[[/Deposition of Copper|Copper]]<br/>
+[[/Deposition of Germanium|Germanium]]<br/>
+[[/Deposition of Molybdenum|Molybdenum]]<br/>
+[[/Deposition of Palladium|Palladium]]<br/>
+[[/Deposition of Silver|Silver]]<br/>
+[[/Deposition of Tin|Tin]]<br/>
+[[/Deposition of Tantalum|Tantalum]]<br/>
+[[/Deposition of Tungsten|Tungsten]]<br/>
+[[/Deposition of Platinum|Platinum]]<br/>
+[[/Deposition of Gold|Gold]]<br/>
+|style="background: #DCDCDC"|
+[[/Deposition of TiW|TiW]] alloy (10%/90% by weight) <br/>
+[[/Deposition of NiCr|NiCr]] alloy  <br/>
+[[/Deposition of AlTi|AlTi]] alloy
+|style="background: LightGray"|
+[[Specific Process Knowledge/Photolithography/SU8|SU8]]<br/>
+Antistiction coating <br/>
+Topas <br/>
+PMMA
+|-
+|}