Specific Process Knowledge/Wafer cleaning: Difference between revisions

Revision as of 10:21, 3 March 2014

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Clean with:

RCA - Two step process to remove organics and metals
7-up & Piranha - Removes organics and alkali ions
5% HF - Removing native oxide
IMEC - Cleaning before fusion bonding
Soap Sonic - Cleaning of "dirty" wafers when entering the cleanroom

Section under construction

Comparison of Wafer Cleaning Methods

	RCA	7-up & Piranha	5% HF	IMEC	Soap Sonic
Generel description	Two step process to remove organics and metals	Removes organics and alkali ions	Removing native oxide	Cleaning before wafer bonding	Cleaning of "dirty" wafers when entering the cleanroom
Purpose	Mandatory prior furnace processes	When needed	Together with RCA cleaning	Prior to wafer bonding	Cleaning very dirty items
Substrate size	#1-25 2", 4" and 6" wafers	#1-25 2", 4" and 6" wafers	#1-25 2", 4" and 6" wafers	#1-25 2" and 4" wafers	All sizes that can go into the bath
Allowed materials	Silicon Poly Silicon Silicon Oxide Silicon Nitride Silicon Oxynitride Quartz/fused silica	Silicon Poly Silicon Silicon Oxide Silicon Nitride Silicon Oxynitride Quartz/fused silica Pyrex and wafers with Cr ONLY in Mask cleaning bath or beaker	Silicon Poly Silicon Silicon Oxide Silicon Nitride Silicon Oxy-nitride Quartz/fused silica Resists (depending on bath) Pyrex (depending on bath)	Silicon Poly Silicon Silicon Oxide Silicon Nitride Silicon Oxynitride Quartz/fused silica Pyrex	All materials

@@ Line 8: / Line 8: @@
 *[[/IMEC|IMEC]] - ''Cleaning before fusion bonding''
 *[[/Cleaning with Soap Sonic|Soap Sonic]] - ''Cleaning of "dirty" wafers when entering the cleanroom''
+== [[Image:section under construction.jpg|70px]] Section under construction ==
+==Comparison of Wafer Cleaning Methods==
+{|border="1" cellspacing="1" cellpadding="3" style="text-align:left;"
+|-
+|-
+|-style="background:silver; color:black"
+!
+![[Specific Process Knowledge/Wafer cleaning/RCA|RCA]]
+![[Specific Process Knowledge/Wafer cleaning/7-up & Piranha|7-up & Piranha]]
+![[Specific Process Knowledge/Wafer cleaning/cleaning with HF|5% HF]]
+![[Specific Process Knowledge/Wafer cleaning/IMEC|IMEC]]
+![[Specific Process Knowledge/Wafer cleaning/Cleaning with Soap Sonic|Soap Sonic]]
+|-
+|-
+|-style="background:WhiteSmoke; color:black"
+!Generel description
+|Two step process to remove organics and metals
+|Removes organics and alkali ions
+|Removing native oxide
+|Cleaning before wafer bonding
+|Cleaning of "dirty" wafers when entering the cleanroom
+|-
+|-
+|-style="background:LightGrey; color:black"
+!Purpose
+|Mandatory prior furnace processes
+|When needed
+|Together with RCA cleaning
+|Prior to wafer bonding
+|Cleaning very dirty items
+|-
+|-
+|-style="background:WhiteSmoke; color:black"
+!Substrate size
+|
+*<nowiki>#</nowiki>1-25 2", 4" and 6" wafers
+|
+*<nowiki>#</nowiki>1-25 2", 4" and 6" wafers
+|
+*<nowiki>#</nowiki>1-25 2", 4" and 6" wafers
+|
+*<nowiki>#</nowiki>1-25 2" and 4" wafers
+|
+*All sizes that can go into the bath
+|-
+|-
+|-style="background:LightGrey; color:black"
+!Allowed materials
+|
+*Silicon
+*Poly Silicon
+*Silicon Oxide
+*Silicon Nitride
+*Silicon Oxynitride
+*Quartz/fused silica
+|
+*Silicon
+*Poly Silicon
+*Silicon Oxide
+*Silicon Nitride
+*Silicon Oxynitride
+*Quartz/fused silica
+*Pyrex and wafers with Cr ONLY in Mask cleaning bath or beaker
+|
+*Silicon
+*Poly Silicon
+*Silicon Oxide
+*Silicon Nitride
+*Silicon Oxy-nitride
+*Quartz/fused silica
+*Resists (depending on bath)
+*Pyrex (depending on bath)
+|
+*Silicon
+*Poly Silicon
+*Silicon Oxide
+*Silicon Nitride
+*Silicon Oxynitride
+*Quartz/fused silica
+*Pyrex
+|
+*All materials
+|-
+|}