Specific Process Knowledge/Thermal Process: Difference between revisions
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== Choose a process type == | == Choose a process type == | ||
Revision as of 12:58, 11 October 2013
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Choose a process type
- Oxidation - grow a thermal oxide
- Annealing
- Dope with Boron
- Dope with Phosphorus
Choose an equipment to use
- Boron Drive-in furnace (A1) - For oxidation and annealing of Si wafesr, and for boron pre-deposition (doping) and for drive-in afterwards
- Boron Predep furnace (A2) - For pre-deposition (doping) of boron on Si wafers
- Phosphorus Drive-in furnace (A3) - For oxidation and annealing of Si wafers and for drive-in after phosphorus pre-dep
- Phosphorus Predep furnace (A4) - For pre-deposition (doping) of phosphorus on Si wafers
- Anneal-oxide furnace(C1) - For oxidation and annealing of 100 mm and 150 mm wafers
- Gate Oxide furnace (C2) - For gate oxide growing on new wafers
- Anneal-bond furnace (C3) - For oxidation and annealing of bonded wafers
- Aluminium Anneal furnace (C4) - For oxidation and annealing of wafers containing aluminium
- Noble furnace - For annealing and oxidation of non-clean wafers
- APOX furnace - For growing of very thick oxide layers
- Jipelec RTP - For rapid thermal annealing of III-V materials and Si based materials
- BCB Curing oven - For resist curing and metal alloying
- Resist Pyrolysis furnace - For pyrolysis of different resist layers