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Specific Process Knowledge/Etch/Wet Silicon Oxide Etch (BHF): Difference between revisions

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image:KOH_4tommer.jpg|BHF in Cleanroom 3 (KOH bench 1+2.) The BHF bath is positioned between the two KOH baths. This is primarily used to remove oxide before and after a KOH etch.  
image:KOH_4tommer.jpg|BHF in Cleanroom 3 (KOH bench 1+2.) The BHF bath is positioned between the two KOH baths. This is primarily used to remove oxide before and after a KOH etch.  
image:KOH3 RR4 1.JPG|BHF in Cleanroom 4 (KOH bench 6".) The BHF bath is positioned to the right. This is primarily used to remove oxide before and after a KOH etch.
image:KOH3 RR4 1.JPG|BHF in Cleanroom 4 (KOH bench 6".) The BHF bath is positioned to the right. This is primarily used to remove oxide before and after a KOH etch.
image:BHF-PolySi-Al Etch.jpg|SIO etch bath(BHF with wetting agent) are positioned to the left in the bench in cleanroom 4.  
image:BHF-PolySi-Al Etch.jpg|SIO etch bath (BHF with wetting agent) are positioned to the left in the bench in cleanroom 4.  
image:Stinkskab RR2.jpg|PP-bath: positioned in the upper right corner of the fumehood in cleanroom 2. </gallery>
image:Stinkskab RR2.jpg|PP-bath: positioned in the upper right corner of the fumehood in cleanroom 2. </gallery>