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Specific Process Knowledge/Back-end processing/Wire Bonder: Difference between revisions

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DCH-Employees-701, NLAB-Employees-701, NLAB-LabmanagerAllUsers
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Kabi (talk | contribs)
DCH-Employees-701, NLAB-Employees-701, NLAB-LabmanagerAllUsers
1,146 edits
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**recommended min. bonding area 200 µm
**recommended min. bonding area 200 µm
*Ball bonding:   
*Ball bonding:   
**recommended min. bonding area 300 µm
**recommended min. bonding area 200 µm
**recommended temperature 120 <sup>o</sup>C.
**recommended temperature 120 <sup>o</sup>C.
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