Specific Process Knowledge/Thin film deposition/Deposition of Chromium: Difference between revisions
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== Studies of Cr deposition processes == | |||
[[/Deposition of Chromium|Uniformity of Cr layers]] -"Uniformity of Cr layers" | |||
[[/Deposition of Chromium|Sputtering Cr Wordentec]] -"Sputtering Cr Wordentec" | |||
Revision as of 13:33, 8 August 2008
Chromium can be deposited by e-beam evaporation. It should be noted that Chromium does not melt but evaporates directly from the solid phase. In the chart below you can compare the different deposition equipment.
| E-beam evaporation (Alcatel) | E-beam evaporation (Leybold) | E-beam evaporation (Wordentec) | Sputter deposition (Wordentec) | |
|---|---|---|---|---|
| Batch size |
|
|
|
|
| Pre-clean | RF Ar clean | Ar ion bombartment | RF Ar clean | RF Ar clean |
| Layer thickness | 10Å to 1µm | 10Å to 0.5µm | 10Å to 1µm | . |
| Deposition rate | 2Å/s to 15Å/s | 1Å/s to 5Å/s | 10Å/s to 15Å/s | . |
Studies of Cr deposition processes
Uniformity of Cr layers -"Uniformity of Cr layers"
Sputtering Cr Wordentec -"Sputtering Cr Wordentec"