Specific Process Knowledge/Lithography/EBeamLithography: Difference between revisions
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All substrates are grounded to the cassette when proper loaded. In a non-conducting substrate, the accumulation of charges in the substrates will however destroy the e-beam patterning. To avoid this, a charge dissipating layer is added on top of the e-beam resist; this will provide a conducting layer for the electrons to escape, while high-energy electrons will pass through the layer to expose the resist. | All substrates are grounded to the cassette when proper loaded. In a non-conducting substrate, the accumulation of charges in the substrates will however destroy the e-beam patterning. To avoid this, a charge dissipating layer is added on top of the e-beam resist; this will provide a conducting layer for the electrons to escape, while high-energy electrons will pass through the layer to expose the resist. | ||
Also, some substrates are transparent for the substrate height detector; a 20 nm Aluminum coating is recommended on these substrates. | |||
If you wish to investigate the charge dissipation using other methods than below, please contact [mailto:lithography@danchip.dtu.dk Lithography]. | If you wish to investigate the charge dissipation using other methods than below, please contact [mailto:lithography@danchip.dtu.dk Lithography]. | ||