Specific Process Knowledge/Etch/Wet Silicon Oxide Etch (BHF): Difference between revisions
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[[Image:BHF_RR3.jpg|300x300px|thumb|Wet Silicon Oxide Etch (BHF): positioned in cleanroom 3]] | [[Image:BHF_RR3.jpg|300x300px|thumb|Wet Silicon Oxide Etch (BHF): positioned in cleanroom 3]] | ||
[[Image:BHF_wetting.jpg|300x300px|thumb|SIO etch (BHF with wetting agent): positioned in cleanroom 4]] | [[Image:BHF_wetting.jpg|300x300px|thumb|SIO etch (BHF with wetting agent): positioned in cleanroom 4]] | ||
[[Image:KOH_4tommer.jpg|225x225px|thumb|BHF between the KOH baths | [[Image:KOH_4tommer.jpg|225x225px|thumb|BHF in Cleanroom3 (KOH bench 1+2.) The BHF bath is positioned between the two KOH baths. This is primarily used to remove oxide before and after a KOH etch]] | ||
[[Image:Fumehoodetch-chrom2.jpg|225x225px|thumb|PP-bath: positioned in fume hood in cleanromm 2]] | [[Image:Fumehoodetch-chrom2.jpg|225x225px|thumb|PP-bath: positioned in fume hood in cleanromm 2]] | ||