Revision as of 14:07, 21 August 2013

UV Lithography uses ultraviolet light to transfer a pattern from a mask to a wafer coated with photoresist. The photoresist film is spin coated on the wafers and the pattern is transferred to the wafer by using a mask aligner. DTU Danchip houses a number of automatic or semi-automatic coaters and mask aligners.

Resist	Comments	Pre-treatment	Resist Coating	Exposure	Baking	Developing	Stripping, Lift-off
AA	AA	AA	AA	AA	AA	AA	AA
BB	BB	BB	BB	BB	BB	BB	BB
CC	CC	CC	CC	CC	CC	CC	CC

Resist Overview

Resist	Polarity	Manufacturer	Comments	Technical reports	Spin Coating	Development	Rinse	Remover	Process flows (in docx-format)
AZ5214E	Positive			AZ5214E.pdf‎	SSE, KS Spinner, III-V Spinner
AZ4562	Positive			AZ4500.pdf‎	SSE, KS Spinner
AZ MiR 701	Positive			AZ_MiR_701.pdf‎	Spin Track 1 + 2				Process_Flow_AZ_MiR701.docx‎
AZ nLOF 2020	Negative			AZ_nLOF_2020.pdf‎	Spin Track 1 + 2				Process_Flow_AZ_nLOF_2020.docx‎
SU8	Positive				KS Spinner

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	UV Lithography uses ultraviolet light to transfer a pattern from a mask to a wafer coated with photoresist. The photoresist film is spin coated on the wafers and the pattern is transferred to the wafer by using a mask aligner. DTU Danchip houses a number of automatic or semi-automatic coaters and mask aligners.		UV Lithography uses ultraviolet light to transfer a pattern from a mask to a wafer coated with photoresist. The photoresist film is spin coated on the wafers and the pattern is transferred to the wafer by using a mask aligner. DTU Danchip houses a number of automatic or semi-automatic coaters and mask aligners.