Specific Process Knowledge/Characterization/Stress measurement: Difference between revisions
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==When the deposition is on one side of the wafer== | ==When the deposition is on one side of the wafer== | ||
#Measure the wafer bow on one of the profilometers ([[Specific Process Knowledge/Characterization/Profiler#Dektak XTA_new stylus profiler|Dektak XTA_new]] or [[Specific Process Knowledge/Characterization/Profiler#Dektak _8 stylus _profiler|Dektak 8]]). Save the measurement. It is a good idea to measure across most of the wafer in two directions perpendicular to each other. | #Measure the wafer bow on one of the profilometers ([[Specific Process Knowledge/Characterization/Profiler#Dektak XTA_new stylus profiler|Dektak XTA_new]] or [[Specific Process Knowledge/Characterization/Profiler#Dektak _8 stylus _profiler|Dektak 8]]). Save the measurement. It is a good idea to measure across most of the wafer (at least along 70% of the wafer length) in two directions perpendicular to each other. | ||
#Deposite the thin film | #Deposite the thin film | ||
#Measure the wafer bow again: | #Measure the wafer bow again: | ||