Specific Process Knowledge/Thin film deposition/Wordentec: Difference between revisions
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We currently only have Al available to deposit through thermal evaporation | We currently only have Al available to deposit through thermal evaporation | ||
===Sputter materials=== | ===Sputter materials=== | ||
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*Chromium (Cr) | *Chromium (Cr) | ||
*Titanium (Ti) | *Titanium (Ti) | ||
===Sample materials that are approved for entering the chamber=== | ===Sample materials that are approved for entering the chamber=== | ||