Specific Process Knowledge/Etch/Wet Silicon Oxide Etch (BHF): Difference between revisions

@@ Line 380: / Line 380: @@
 |}
-===Comparing different HF baths===
+===Comparing different 5% HF baths===
 {|border="1" cellspacing="1" cellpadding="3" style="text-align:left;"
 |-
@@ Line 407: / Line 407: @@
 !Allowed materials
 |Only for wafers that are being RCA cleaned
+|All materials
+|All materials
+|-
+|}
+===Comparing different 40% HF baths===
+{|border="1" cellspacing="1" cellpadding="3" style="text-align:left;"
+|-
+|-style="background:silver; color:black"
+!
+! 40% HF PP-bath
+! 40% HF Plastic beaker
+|-
+|-style="background:WhiteSmoke; color:black"
+!Batch size!
+|1-25 wafers at a time
+|1 wafer at a time
+|-
+|-style="background:LightGrey; color:black"
+!Size of substrate
+|Any that fits to a dedicated holder
+|Any that fits to a dedicated holder
+|-
+|-style="background:WhiteSmoke; color:black"
+!Allowed materials
 |All materials
 |All materials
 |-
 |}