Jump to content

Specific Process Knowledge/Etch/Wet Silicon Oxide Etch (BHF): Difference between revisions

Kabi (talk | contribs)
Kabi (talk | contribs)
Line 213: Line 213:
*:[http://kemibrug.dk/KBA/CAS/106534/?show_KBA=1&portaldesign=1 see KBA here]
*:[http://kemibrug.dk/KBA/CAS/106534/?show_KBA=1&portaldesign=1 see KBA here]
|-
|-
!style="background:silver; color:black" align="center" valign="center" rowspan="4"|Performance
!style="background:silver; color:black" align="center" valign="center" rowspan="2"|Performance
|style="background:LightGrey; color:black"|Isotropic
|style="background:LightGrey; color:black"|Isotropic
|style="background:WhiteSmoke; color:black"|
|style="background:WhiteSmoke; color:black"|
Line 239: Line 239:
*A little higher etch rates than BHF
*A little higher etch rates than BHF
|-
|-
!style="background:silver; color:black" align="center" valign="center" rowspan="3"|Process parameter range
!style="background:silver; color:black" align="center" valign="center" rowspan="2"|Process parameter range
|style="background:LightGrey; color:black"|Chemical solution
|style="background:LightGrey; color:black"|Chemical solution
|style="background:WhiteSmoke; color:black"|
|style="background:WhiteSmoke; color:black"|