Specific Process Knowledge/Etch/KOH Etch: Difference between revisions
No edit summary |
|||
| Line 184: | Line 184: | ||
*Thermal SiO2 | *Thermal SiO2 | ||
|- | |- | ||
|} | |||
===Definition of structures=== | ===Definition of structures=== | ||
No edit summary |
|||
| Line 184: | Line 184: | ||
*Thermal SiO2 | *Thermal SiO2 | ||
|- | |- | ||
|} | |||
===Definition of structures=== | ===Definition of structures=== | ||