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Specific Process Knowledge/Etch/KOH Etch: Difference between revisions

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DCH-Employees-701, NLAB-Employees-701, NLAB-LabmanagerAllUsers
1,146 edits
Kabi (talk | contribs)
DCH-Employees-701, NLAB-Employees-701, NLAB-LabmanagerAllUsers
1,146 edits
Line 255: Line 255:
|style="background:LightGrey; color:black"|Masking material
|style="background:LightGrey; color:black"|Masking material
|style="background:WhiteSmoke; color:black"|
|style="background:WhiteSmoke; color:black"|
*Silicon: ~0.04-0.8 µm/min
*Silicon
*Silicon oxide: ~0.02-0.15 µm/min
*Silicon oxide  
*Silicon (oxy)nitride: ~0.02-? µm/min
*Silicon (oxy)nitride
|style="background:WhiteSmoke; color:black"|
|style="background:WhiteSmoke; color:black"|
*Silicon: ~0.04-0.8 µm/min
*Silicon
*Silicon oxide: ~0.02-0.15 µm/min
*Silicon oxide  
*Silicon (oxy)nitride: ~0.02-? µm/min
*Silicon (oxy)nitride
|style="background:WhiteSmoke; color:black"|
|style="background:WhiteSmoke; color:black"|
*Silicon: ~0.04-0.8 µm/min
*Silicon
*Silicon oxide: ~0.02-0.15 µm/min
*Silicon oxide  
*Silicon (oxy)nitride: ~0.02-? µm/min
*Silicon (oxy)nitride
|style="background:WhiteSmoke; color:black"|
|style="background:WhiteSmoke; color:black"|
*Silicon: ~0.04-0.8 µm/min
*Silicon
*Silicon oxide: ~0.02-0.15 µm/min
*Silicon oxide  
*Silicon (oxy)nitride: ~0.02-? µm/min
*Silicon (oxy)nitride
|-
|-
<br clear="all" />
<br clear="all" />
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