Specific Process Knowledge/Etch/KOH Etch: Difference between revisions
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*Etch of Silicon in user mixed KOH | *Etch of Silicon in user mixed KOH | ||
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!style="background:silver; color:black" align="center" valign="center" rowspan=" | !style="background:silver; color:black" align="center" valign="center" rowspan="4"|Performance | ||
|style="background:LightGrey; color:black"|Etch rates | |style="background:LightGrey; color:black"|Etch rates | ||
|style="background:WhiteSmoke; color:black"| | |style="background:WhiteSmoke; color:black"| | ||
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*Silicon (oxy)nitride: ~0.02-? µm/min | *Silicon (oxy)nitride: ~0.02-? µm/min | ||
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!style="background:silver; color:black" align="center" valign="center" rowspan="2"|Performance | |||
|style="background:LightGrey; color:black"|Etch rates | |style="background:LightGrey; color:black"|Etch rates | ||
|style="background:WhiteSmoke; color:black"| | |style="background:WhiteSmoke; color:black"| | ||