Jump to content

Specific Process Knowledge/Etch/KOH Etch: Difference between revisions

← Older editNewer edit →
VisualWikitext
Kabi (talk | contribs)
DCH-Employees-701, NLAB-Employees-701, NLAB-LabmanagerAllUsers
1,146 edits
Kabi (talk | contribs)
DCH-Employees-701, NLAB-Employees-701, NLAB-LabmanagerAllUsers
1,146 edits
Line 194: Line 194:
*Silicon (oxy)nitride: ~0.02-? µm/min
*Silicon (oxy)nitride: ~0.02-? µm/min
|-
|-
!style="background:silver; color:black" align="center" valign="center" rowspan="2"|Performance
|style="background:LightGrey; color:black"|Etch rates
|style="background:LightGrey; color:black"|Etch rates
|style="background:WhiteSmoke; color:black"|
|style="background:WhiteSmoke; color:black"|
Line 212: Line 211:
*Silicon (oxy)nitride: ~0.02-? µm/min
*Silicon (oxy)nitride: ~0.02-? µm/min
|-
|-
!style="background:silver; color:black" align="center" valign="center" rowspan="2"|Performance
|style="background:LightGrey; color:black"|Etch rates
|style="background:LightGrey; color:black"|Etch rates
|style="background:WhiteSmoke; color:black"|
|style="background:WhiteSmoke; color:black"|
Retrieved from "https://labadviser.nanolab.dtu.dk//index.php?title=Specific_Process_Knowledge/Etch/KOH_Etch"