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Specific Process Knowledge/Etch/KOH Etch: Difference between revisions

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Kabi (talk | contribs)
DCH-Employees-701, NLAB-Employees-701, NLAB-LabmanagerAllUsers
1,146 edits
Kabi (talk | contribs)
DCH-Employees-701, NLAB-Employees-701, NLAB-LabmanagerAllUsers
1,146 edits
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*Silicon (oxy)nitride: ~0.02-? µm/min
*Silicon (oxy)nitride: ~0.02-? µm/min
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!style="background:silver; color:black" align="center" valign="center" rowspan="2"|Performance
|style="background:LightGrey; color:black"|Etch rates
|style="background:LightGrey; color:black"|Etch rates
|style="background:WhiteSmoke; color:black"|
|style="background:WhiteSmoke; color:black"|
Line 177: Line 176:
*Silicon (oxy)nitride: ~0.02-? µm/min
*Silicon (oxy)nitride: ~0.02-? µm/min
|-
|-
!style="background:silver; color:black" align="center" valign="center" rowspan="2"|Performance
|style="background:LightGrey; color:black"|Etch rates
|style="background:LightGrey; color:black"|Etch rates
|style="background:WhiteSmoke; color:black"|
|style="background:WhiteSmoke; color:black"|
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