Specific Process Knowledge/Lithography/UVLithography: Difference between revisions

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UV Lithography uses ultraviolet light to transfer a pattern from a mask to a wafer coated with photoresist.  The photoresist film is spin coated on the wafers and the pattern is transferred to the wafer by using a mask aligner. DTU Danchip houses a number of automatic or semi-automatic coaters and mask aligners.
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*DD2
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Revision as of 14:04, 21 August 2013

UV Lithography uses ultraviolet light to transfer a pattern from a mask to a wafer coated with photoresist. The photoresist film is spin coated on the wafers and the pattern is transferred to the wafer by using a mask aligner. DTU Danchip houses a number of automatic or semi-automatic coaters and mask aligners.


Resist Comments Pre-treatment Resist Coating Exposure Baking Developing Stripping, Lift-off
AA AA AA AA AA AA AA AA
BB BB BB BB BB BB BB BB
CC CC CC CC CC CC CC CC


Resist Overview

Resist Polarity Manufacturer Comments Technical reports Spin Coating Development Rinse Remover Process flows (in docx-format)
AZ5214E Positive AZ5214E.pdf‎ SSE, KS Spinner, III-V Spinner


AZ4562 Positive AZ4500.pdf‎ SSE, KS Spinner
AZ MiR 701 Positive AZ_MiR_701.pdf‎ Spin Track 1 + 2 Process_Flow_AZ_MiR701.docx‎
AZ nLOF 2020 Negative AZ_nLOF_2020.pdf‎ Spin Track 1 + 2 Process_Flow_AZ_nLOF_2020.docx‎


SU8 Positive KS Spinner