Specific Process Knowledge/Lithography/Coaters: Difference between revisions
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* Cassette-to-cassette | * Cassette-to-cassette | ||
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| | |Single substrate | ||
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|style="background:LightGrey; color:black"|Permanent media | |style="background:LightGrey; color:black"|Permanent media | ||
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* PGMEA for backside rinse and edge-bead removal | * PGMEA for backside rinse and edge-bead removal | ||
* PGMEA for spinner bowl cleaning and vapor tip bath | * PGMEA for spinner bowl cleaning and vapor tip bath | ||
| | |Only manual dispense | ||
| | |Only manual dispense | ||
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|style="background:LightGrey; color:black"|Manual dispense option | |style="background:LightGrey; color:black"|Manual dispense option | ||
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*10 - 9990 rpm | *10 - 9990 rpm | ||
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| | |10-5000 rpm | ||
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|style="background:LightGrey; color:black"|Parameter 2 | |style="background:LightGrey; color:black"|Parameter 2 | ||
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* Maximum substrate size: 6" | |||
* Minimum substrate size: 3*3 mm2 | |||
* maximum substrate thickness: 4 mm | |||
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| style="background:LightGrey; color:black"|Allowed materials | | style="background:LightGrey; color:black"|Allowed materials | ||
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*III-V compound semiconductors | |||
*Si, SiO2, SOI | |||
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