Specific Process Knowledge/Lithography/Coaters: Difference between revisions
| Line 12: | Line 12: | ||
|style="background:WhiteSmoke; color:black"|<b>[[Specific_Process_Knowledge/Lithography/Coaters#III-V Spinner|III-V Spinner]]</b> | |style="background:WhiteSmoke; color:black"|<b>[[Specific_Process_Knowledge/Lithography/Coaters#III-V Spinner|III-V Spinner]]</b> | ||
|- | |- | ||
!style="background:silver; color:black;" align="center"|Purpose | !style="background:silver; width:100px; color:black;" align="center"|Purpose | ||
|style="background:LightGrey; color:black"| | |style="background:LightGrey; color:black"| | ||
|style="background:WhiteSmoke; color:black"| | |style="background:WhiteSmoke; color:black"| | ||
| Line 27: | Line 27: | ||
*Coating and baking of AZ nLOF 2020 resist | *Coating and baking of AZ nLOF 2020 resist | ||
*Post-exposure baking at 110°C | *Post-exposure baking at 110°C | ||
| | |||
| | |||
|- | |- | ||
!style="background:silver; color:black" align="center" valign="center" rowspan="3"|Performance | !style="background:silver; color:black" align="center" valign="center" rowspan="3"|Performance | ||
| Line 37: | Line 39: | ||
* Non-vacuum chuck for fragile substrates | * Non-vacuum chuck for fragile substrates | ||
|style="background:WhiteSmoke; color:black"| | |style="background:WhiteSmoke; color:black"| | ||
* Cassette-to-cassette | * Cassette-to-cassette | ||
| | |||
| | |||
|- | |- | ||
|style="background:LightGrey; color:black"|Permanent media | |style="background:LightGrey; color:black"|Permanent media | ||
| Line 53: | Line 57: | ||
* AZ nLOF 2020 resist | * AZ nLOF 2020 resist | ||
* PGMEA for backside rinse and edge-bead removal | * PGMEA for backside rinse and edge-bead removal | ||
* PGMEA for spinner bowl cleaning and vapor tip bath | * PGMEA for spinner bowl cleaning and vapor tip bath | ||
| | |||
| | |||
|- | |- | ||
|style="background:LightGrey; color:black"|Manual dispense option | |style="background:LightGrey; color:black"|Manual dispense option | ||
| Line 63: | Line 69: | ||
|style="background:WhiteSmoke; color:black"| | |style="background:WhiteSmoke; color:black"| | ||
* no | * no | ||
| | |||
| | |||
|- | |- | ||
!style="background:silver; color:black" align="center" valign="center" rowspan="2"|Process parameter range | !style="background:silver; color:black" align="center" valign="center" rowspan="2"|Process parameter range | ||
| Line 72: | Line 80: | ||
|style="background:WhiteSmoke; color:black"| | |style="background:WhiteSmoke; color:black"| | ||
*10 - 9990 rpm | *10 - 9990 rpm | ||
| | |||
| | |||
|- | |- | ||
|style="background:LightGrey; color:black"|Parameter 2 | |style="background:LightGrey; color:black"|Parameter 2 | ||
| Line 80: | Line 90: | ||
|style="background:WhiteSmoke; color:black"| | |style="background:WhiteSmoke; color:black"| | ||
*Range | *Range | ||
| | |||
| | |||
|- | |- | ||
!style="background:silver; color:black" align="center" valign="center" rowspan="3"|Substrates | !style="background:silver; color:black" align="center" valign="center" rowspan="3"|Substrates | ||
| Line 91: | Line 103: | ||
*<nowiki>1</nowiki> 150 mm wafer | *<nowiki>1</nowiki> 150 mm wafer | ||
|style="background:WhiteSmoke; color:black"| | |style="background:WhiteSmoke; color:black"| | ||
*<nowiki>25</nowiki> 100 mm wafers | *<nowiki>25</nowiki> 100 mm wafers | ||
| | |||
| | |||
|- | |- | ||
| style="background:LightGrey; color:black"|Allowed materials | | style="background:LightGrey; color:black"|Allowed materials | ||
| Line 104: | Line 118: | ||
*Silicon | *Silicon | ||
*Glass | *Glass | ||
| | |||
| | |||
|- | |- | ||
|} | |} | ||