Specific Process Knowledge/Lithography/EBeamLithography: Difference between revisions

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-The table describes the e-beam resist used in the cleanroom for standard e-beam exposure. Some of resists are not provided by DTU Danchip and some are not yet approved for common use in the cleanroom and are currently being tested. If you wish to test some of these resists or other resists, please contact [mailto:lithography@danchip.dtu.dk].
+The table describes the e-beam resist used in the cleanroom for standard e-beam exposure. Some of resists are not provided by DTU Danchip and some are not yet approved for common use in the cleanroom and are currently being tested. If you wish to test some of these resists or other resists, please contact [mailto:lithography@danchip.dtu.dk Lithography].
 {|border="1" cellspacing="1" cellpadding="3" style="text-align:left;" width="100%"
@@ Line 135: / Line 135: @@
 |Positive
 |ZEON
-|Low dose to clear. Used for trilayer (PEC-free) resist-stack. Please contact [[mailto:Lithography@danchip.dtu.dk Lithography]] for information.
+|Low dose to clear. Used for trilayer (PEC-free) resist-stack. Please contact [mailto:Lithography@danchip.dtu.dk Lithography] for information.
 |[[media:ZEP7000.pdf|ZEP7000.pdf]]
 |[[Specific_Process_Knowledge/Lithography/Coaters#Manual Spinner 1|Manual Spinner 1 (Laurell)]], [[Specific_Process_Knowledge/Lithography/Coaters#III-V Spinner|III-V Spinner]]
@@ Line 148: / Line 148: @@
 |Positive
 |
-|We have various types of PMMA in the cleanroom, none are provided by DTU Danchip. Please contact [[mailto:Lithography@danchip.dtu.dk Lithography]] for information.
+|We have various types of PMMA in the cleanroom, none are provided by DTU Danchip. Please contact [mailto:Lithography@danchip.dtu.dk Lithography] for information.
 |
 |[[Specific_Process_Knowledge/Lithography/Coaters#Manual Spinner 1|Manual Spinner 1 (Laurell)]], [[Specific_Process_Knowledge/Lithography/Coaters#III-V Spinner|III-V Spinner]]
@@ Line 161: / Line 161: @@
 |Positive
 |AllResist
-|Approved, not tested yet. Used for trilayer (PEC-free) resist-stack or double-layer lift-off resist stack. Please contact [[mailto:Lithography@danchip.dtu.dk Lithography]] for information.
+|Approved, not tested yet. Used for trilayer (PEC-free) resist-stack or double-layer lift-off resist stack. Please contact [mailto:Lithography@danchip.dtu.dk Lithography] for information.
 |[[media:AR_P617.pdf‎|AR_P617.pdf‎]]
 |[[Specific_Process_Knowledge/Lithography/Coaters#Manual Spinner 1|Manual Spinner 1 (Laurell)]], [[Specific_Process_Knowledge/Lithography/Coaters#III-V Spinner|III-V Spinner]]
@@ Line 175: / Line 175: @@
 |Positive
 |AllResist
-|Approved, not tested yet. Should work similar to ZEP520A. Please contact [[mailto:Lithography@danchip.dtu.dk Lithography]] for information.
+|Approved, not tested yet. Should work similar to ZEP520A. Please contact [mailto:Lithography@danchip.dtu.dk Lithography] for information.
 |[[media:CSAR_62_and_process_chemicals.pdf‎|CSAR_62_and_process_chemicals.pdf‎]]
 |[[Specific_Process_Knowledge/Lithography/Coaters#Manual Spinner 1|Manual Spinner 1 (Laurell)]], [[Specific_Process_Knowledge/Lithography/Coaters#III-V Spinner|III-V Spinner]]
@@ Line 215: / Line 215: @@
 |Negative
 |AllResist
-|Both e-beam, DUV and UV-sensitive resist. Currently being tested, contact [[mailto:pxshi@danchip.dtu.dk Peixiong Shi]] for information.
+|Both e-beam, DUV and UV-sensitive resist. Currently being tested, contact [mailto:pxshi@danchip.dtu.dk Peixiong Shi] for information.
 |[[media:AR-N7500-7520.pdf‎|AR-N7500-7520.pdf‎]]
 |[[Specific_Process_Knowledge/Lithography/Coaters#Manual Spinner 1|Manual Spinner 1 (Laurell)]], [[Specific_Process_Knowledge/Lithography/Coaters#III-V Spinner|III-V Spinner]]