Specific Process Knowledge/Lithography/EBeamLithography: Difference between revisions

Revision as of 10:54, 8 August 2013 view source Tigre (talk \| contribs) DCH-Employees-701 2,257 edits →Charge dissipating agent ← Older edit		Revision as of 10:54, 8 August 2013 view source Tigre (talk \| contribs) DCH-Employees-701 2,257 edits →Proximity Error Correction (PEC) in BEAMER Newer edit →
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	Alternatively, a [http://en.wikipedia.org/wiki/Proximity_effect_%28electron_beam_lithography%29 point-spread function] can be used in BEAMER to calculate the optimised dose-variation.		Alternatively, a [http://en.wikipedia.org/wiki/Proximity_effect_%28electron_beam_lithography%29 point-spread function] can be used in BEAMER to calculate the optimised dose-variation.


	== Trilayer resist stack ==		== Trilayer resist stack ==