Specific Process Knowledge/Wafer cleaning: Difference between revisions

Revision as of 13:29, 12 October 2007

RCA - Two step process to remove organics and metals
7-up - Fake piranha etch of wafers and masks - removes organics and alkali ions
Piranha - Removes organics and alkali ions
BHF - Removing native oxide, etching of predep glass etc.
IMEC - Cleaning before fusion bonding
Soap Sonic - Cleaning of "dirty" wafers when entering the cleanroom

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(No difference)