Specific Process Knowledge/Lithography/EBeamLithography: Difference between revisions
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|Low dose to clear. Used for trilayer (PEC-free) resist-stack. Please contact Lithography. Technical Report to be found here: [[media:ZEP7000.pdf|ZEP7000.pdf]] | |Low dose to clear. Used for trilayer (PEC-free) resist-stack. Please contact Lithography. Technical Report to be found here: [[media:ZEP7000.pdf|ZEP7000.pdf]] | ||
|Technical Report to be found here: | |Technical Report to be found here: | ||
|Approved, not tested yet. Used for trilayer (PEC-free) resist-stack or double-layer lift-off resist stack. Technical Report to be found here: | |Approved, not tested yet. Used for trilayer (PEC-free) resist-stack or double-layer lift-off resist stack. Technical Report to be found here: [[media:AR_P617.pdf|AR_P617.pdf]] | ||
|Approved, not tested yet. Technical Report to be found here: | |Approved, not tested yet. Technical Report to be found here: | ||
|Approved, not tested yet. Should work quite similar as ZEP520A. Please contact Lithography. Technical Report to be found here: | |Approved, not tested yet. Should work quite similar as ZEP520A. Please contact Lithography. Technical Report to be found here: | ||