Specific Process Knowledge/Lithography/EBeamLithography: Difference between revisions
| Line 156: | Line 156: | ||
|-style="background:WhiteSmoke; color:black" | |-style="background:WhiteSmoke; color:black" | ||
|'''Comments''' | |'''Comments''' | ||
|Standard positive resist. Technical Report to be found here: | |Standard positive resist. Technical Report to be found here: [[media:ZEP520A.pdf|ZEP520A.pdf]] | ||
| | |Low dose to clear. Please contact Lithography. Technical Report to be found here: [[media:ZEP7000.pdf|ZEP7000.pdf]] | ||
|Technical Report to be found here: | |Technical Report to be found here: | ||
|Approved, not tested yet. Used for trilayer (PEC-free) resist-stack or double-layer lift-off resist stack. Technical Report to be found here: | |Approved, not tested yet. Used for trilayer (PEC-free) resist-stack or double-layer lift-off resist stack. Technical Report to be found here: | ||