Specific Process Knowledge/Lithography/EBeamLithography: Difference between revisions

Revision as of 13:23, 2 August 2013 view source Tigre (talk \| contribs) DCH-Employees-701 2,257 edits →Process Flows ← Older edit		Revision as of 13:26, 2 August 2013 view source Tigre (talk \| contribs) DCH-Employees-701 2,257 edits →Process Flows Newer edit →
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	[[Image:Process_Flow_ZEP.jpg\|400x400px~~\|thumb~~\|'''Process Flow for standard ZEP spinning, e-beam exposure and developing.''']]		[[Image:Process_Flow_ZEP.jpg\|400x400px\|'''Process Flow for standard ZEP spinning, e-beam exposure and developing.''']]

	You can use the SSE-spinner, the Manual Spinner 1 or the III-V spinner to coat wafer or chips with e-beam resist. Read more about these spinners		You can use the SSE-spinner, the Manual Spinner 1 or the III-V spinner to coat wafer or chips with e-beam resist. Read more about these spinners