Specific Process Knowledge/Lithography/EBeamLithography: Difference between revisions
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[[media:Process_Flow_ZEP.docx|Process_Flow_ZEP.docx]]. | [[media:Process_Flow_ZEP.docx|Process_Flow_ZEP.docx]]. | ||
[[Image:Process_Flow_ZEP.jpg|400x400px|thumb|'''Process Flow for standard ZEP spinning, e-beam exposure and developing.''']] | |||
You can use the SSE-spinner, the Manual Spinner 1 or the III-V spinner to coat wafer or chips with e-beam resist. Read more about these spinners | You can use the SSE-spinner, the Manual Spinner 1 or the III-V spinner to coat wafer or chips with e-beam resist. Read more about these spinners | ||