Specific Process Knowledge/Lithography/EBeamLithography: Difference between revisions
No edit summary |
|||
| Line 90: | Line 90: | ||
* A BEAMER manual describing how to convert your pattern file (GDSII-format) to v30-format (found under 'Technical Documents')''' | * A BEAMER manual describing how to convert your pattern file (GDSII-format) to v30-format (found under 'Technical Documents')''' | ||
= | = Process Flows = | ||
You can use the SSE-spinner, the Manual Spinner 1 or the III-V spinner to coat wafer or chips with e-beam resist. Read more about these spinners | You can use the SSE-spinner, the Manual Spinner 1 or the III-V spinner to coat wafer or chips with e-beam resist. Read more about these spinners | ||
<span class="plainlinks">[http://labadviser.danchip.dtu.dk/index.php/Specific_Process_Knowledge/Lithography/Coaters here]</span> (opens in a new tab). | <span class="plainlinks">[http://labadviser.danchip.dtu.dk/index.php/Specific_Process_Knowledge/Lithography/Coaters here]</span> (opens in a new tab). | ||
= | = Proximity Error Correction = | ||
* PEC in BEAMER | |||
* trilayer flow, not tested | |||
= Charge dissipating agent = | |||
* Al coating, FLOW | |||
* ESPACER, no flow yet | |||