Specific Process Knowledge/Lithography/Coaters: Difference between revisions
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===Process information=== | ===Process information=== | ||
*[[Specific Process Knowledge/Lithography/Coaters/Spin Track 1 + 2 processing#General Process Information|General Spin Track 1 + 2 process information]] | *[[Specific Process Knowledge/Lithography/Coaters/Spin Track 1 + 2 processing#General Process Information|General Spin Track 1 + 2 process information]] | ||
*[[Specific Process Knowledge/Lithography/Coaters/Spin Track 1 + 2 processing#HMDS priming only|HMDS priming on Spin Track 1 | *[[Specific Process Knowledge/Lithography/Coaters/Spin Track 1 + 2 processing#HMDS priming only|HMDS priming on Spin Track 1 and 2]] | ||
*[[Specific Process Knowledge/Lithography/Coaters/Spin Track 1 + 2 processing#AZ MiR 701 (29cps) coating|AZ MiR 701 (29cps) coating on Spin Track 1]] | *[[Specific Process Knowledge/Lithography/Coaters/Spin Track 1 + 2 processing#AZ MiR 701 (29cps) coating|AZ MiR 701 (29cps) coating on Spin Track 1]] | ||
*[[Specific Process Knowledge/Lithography/Coaters/Spin Track 1 + 2 processing#AZ nLOF 2020 coating|AZ nLOF 2020 coating on Spin Track 2]] | *[[Specific Process Knowledge/Lithography/Coaters/Spin Track 1 + 2 processing#AZ nLOF 2020 coating|AZ nLOF 2020 coating on Spin Track 2]] |
Revision as of 15:35, 24 June 2013
Coaters: Comparison Table
Equipment | SSE Spinner | KS Spinner | Spin Track 1 + 2 | |
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Purpose |
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Performance | Substrate handling |
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Permanent media |
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Manual dispense option |
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Process parameter range | Spindle speed |
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Parameter 2 |
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Substrates | Batch size |
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Allowed materials |
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SSE Spinner
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The SSE spinner MAXIMUS: positioned in Cleanroom 13. SSE Spinner, Maximus 804, SSE Sister Semiconductor Equipment is a resist spinning system at Danchip which can be used for spinning on 2", 4" and 6" substrates.
The system is equipped with 2 different resists lines:
- AZ5214E and
- AZ4562 and
- 2 syringe lines, which can be used for spinning of e-beam resist.
The user manual(s), quality control procedure(s) and results and contact information can be found in LabManager: Equipment info in LabManager
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Spin Track 1 + 2
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Spin Track 1 + 2 is an SVG 88 series track system from Rite Track. Each track consists of a HMDS priming module, a spin coating module, and a baking module. In fact, the only difference between the two tracks is the resist used in the spin coating module. Spin Track 1 + 2 is capable of handling 150 mm wafers, as well as 100 mm wafers, but is currently set up for 100 mm wafer processing.
The Spin Track 1 + 2 is controlled using the Recipe Manager software via the touchscreen on the arm attached to the lefthand end of the track. Recipes for the individual modules are developed by Danchip and combined into flows. The user selects a flow (specific to track 1 or 2), and the appropriate recipes will be downloaded and executed on the appropriate track. The other track runs an empty process (no wafers needed), and can unfortunately not be used by a second user while the first user is processing.
The user manual(s), quality control procedure(s) and results, user APV(s), technical information and contact information can be found in LabManager
Process information
- General Spin Track 1 + 2 process information
- HMDS priming on Spin Track 1 and 2
- AZ MiR 701 (29cps) coating on Spin Track 1
- AZ nLOF 2020 coating on Spin Track 2
- Post-exposure baking on Spin Track 2
Spin Track | 1 | 2 | |
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Purpose |
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| |
Resist |
AZ MiR 701 (29cps) positive tone |
AZ nLOF 2020 negative tone | |
Performance | Coating thickness |
1 - 3 µm |
1.6 - 5 µm |
HMDS contact angle |
60 - 90° (on SiO2) | ||
Process parameters | Spin speed |
10 - 9990 rpm | |
Spin acceleration |
1000 - 50000 rpm/s | ||
Hotplate temperature |
90°C |
110°C | |
HMDS priming temperature |
50°C | ||
Substrates | Substrate size |
100 mm wafers | |
Allowed materials |
Silicon (with oxide, nitride, or metal films or patterning) Glass (borosilicate and quartz) | ||
Batch |
1 - 25 |
KS Spinner
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Manual Spinner 1 (Laurell)
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