Specific Process Knowledge/Lithography/Coaters: Difference between revisions
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===Process information=== | ===Process information=== | ||
====HMDS priming only==== | |||
The standard HMDS priming process has been developed to mimic the behavior of the IMTEC Star2000 HMDS oven. | The standard HMDS priming process has been developed to mimic the behavior of the IMTEC Star2000 HMDS oven. | ||
Process: 10s contact bake (at 50°C). 30s vacuum bake (~0.5 bar). 72s HMDS priming (nitrogen carrier gas). 2 nitrogen pump-purge cycles. | Process: 10s contact bake (at 50°C). 30s vacuum bake (~0.5 bar). 72s HMDS priming (nitrogen carrier gas). 2 nitrogen pump-purge cycles. | ||
This process produces a contact angle of 81-82° on an oxidized silicon surface. | |||
'''Flow names and test results:''' | |||
*T1 T2 Standard | *T1 T2 Standard | ||
Tested ?/5 2013 on 100nm oxide: 81.4°. Tested ?/6 2013 on 3µm oxide: 81.8°. | Tested ?/5 2013 on 100nm oxide: 81.4°. Tested ?/6 2013 on 3µm oxide: 81.8°. | ||