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Specific Process Knowledge/Lithography/Coaters: Difference between revisions

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Taran (talk | contribs)
DCH-Employees-701, NLAB-Employees-701, NLAB-LabmanagerAllUsers, NLAB-Nlab307-labadviser-users-34891
3,526 edits
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'''HMDS priming only:'''
'''HMDS priming only:'''
The standard HMDS priming process has been developed to mimic the behavior of the IMTEC Star2000 HMDS oven.
Process: 10s contact bake (at 50°C). 30s vacuum bake (~0.5 bar). 72s HMDS priming (nitrogen carrier gas). 2 nitrogen pump-purge cycles.
[[Flow(s):]]
*T1 T2 Standard
*T1 T2 Standard
Produces a contact angle of 81-82° on an oxidized silicon surface.
Tested ?/5 2013 on 100nm oxide: 81.4°. Tested ?/6 2013 on 3µm oxide: 81.8°.


'''AZ MiR 701 (29cps) coating:'''
'''AZ MiR 701 (29cps) coating:'''
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