Specific Process Knowledge/Lithography/Coaters: Difference between revisions
Appearance
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*In-line substrate HMDS priming | *In-line substrate HMDS priming | ||
* | *Coating and baking of AZ MiR 701 (29cps) resist | ||
* | *Coating and baking of AZ nLOF 2020 resist | ||
*Post-exopsure baking at 110°C | *Post-exopsure baking at 110°C | ||
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*<nowiki>1</nowiki> 100 mm wafers | *<nowiki>1</nowiki> 100 mm wafers | ||
*<nowiki>1</nowiki> 150 mm wafers | *<nowiki>1</nowiki> 150 mm wafers | ||
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*<nowiki>25</nowiki> 100 mm wafers | |||
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| style="background:LightGrey; color:black"|Allowed materials | | style="background:LightGrey; color:black"|Allowed materials | ||