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Specific Process Knowledge/Lithography/Coaters: Difference between revisions

Taran (talk | contribs)
Taran (talk | contribs)
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*In-line substrate HMDS priming
*In-line substrate HMDS priming
*Spinning and baking of AZ MiR 701 (29cps) resist
*Coating and baking of AZ MiR 701 (29cps) resist
*Spinning and baking of AZ nLOF 2020 resist
*Coating and baking of AZ nLOF 2020 resist
*Post-exopsure baking at 110°C
*Post-exopsure baking at 110°C
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*<nowiki>1</nowiki> 100 mm wafers
*<nowiki>1</nowiki> 100 mm wafers
*<nowiki>1</nowiki> 150 mm wafers  
*<nowiki>1</nowiki> 150 mm wafers  
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*<nowiki>25</nowiki> 100 mm wafers
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| style="background:LightGrey; color:black"|Allowed materials
| style="background:LightGrey; color:black"|Allowed materials