Specific Process Knowledge/Lithography/Coaters: Difference between revisions
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'''The user manual(s), quality control procedure(s) and results, user APV(s), technical information and contact information can be found in [http://labmanager.danchip.dtu.dk/function.php?module=Machine&view=view&mach=313 LabManager]''' | '''The user manual(s), quality control procedure(s) and results, user APV(s), technical information and contact information can be found in [http://labmanager.danchip.dtu.dk/function.php?module=Machine&view=view&mach=313 LabManager]''' | ||
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===Process information=== | |||
Link to process pages - e.g. one page for each material | |||
Example: | |||
*[[Specific Process Knowledge/Etch/Etching of Silicon/Si etch using RIE1 or RIE2|Etch of silicon using RIE]] | |||
*[[Specific Process Knowledge/Etch/Etching of Silicon Oxide/SiO2 etch using RIE1 or RIE2|Etch of silicon oxide using RIE]] | |||
*[[Specific Process Knowledge/Etch/Etching of Silicon Nitride/Etch of Silicon Nitride using RIE|Etch of silicon nitride using RIE]] | |||
*[[Specific Process Knowledge/Etch/Etching of Polymer/Etch of Photo Resist using RIE|Etch of photo resist using RIE]] | |||
=== Equipment performance and process related parameters === | === Equipment performance and process related parameters === | ||
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==KS Spinner== | ==KS Spinner== | ||