Specific Process Knowledge/Lithography/Coaters: Difference between revisions
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Spin Track 1 + 2 is an SVG 88 series track system from Rite Track. Each track consists of a HMDS priming module, a spin coating module, and a baking module. In fact, the only difference between the two tracks is the resist used in the spin coating module. Spin Track 1 + 2 is capable of handling 150 mm wafers, as well as 100 mm | Spin Track 1 + 2 is an SVG 88 series track system from Rite Track. Each track consists of a HMDS priming module, a spin coating module, and a baking module. In fact, the only difference between the two tracks is the resist used in the spin coating module. Spin Track 1 + 2 is capable of handling 150 mm wafers, as well as 100 mm wafers, but is currently set up for 100 mm wafer processing. | ||
The Spin Track 1 + 2 is controlled using the Recipe Manager software via the touchscreen on the arm attached to the lefthand end of the track. Recipes for the individual modules are developed by Danchip and combined into flows. The user selects a flow (specific to track 1 or 2), and the appropriate recipes will be downloaded and executed on the appropriate track. The other track will run an empty process (no wafers needed), and can unfortunately not be used. | |||
'''The user manual(s), quality control procedure(s) and results, user APV(s), technical information and contact information can be found in [http://labmanager.danchip.dtu.dk/function.php?module=Machine&view=view&mach=313 LabManager]''' | '''The user manual(s), quality control procedure(s) and results, user APV(s), technical information and contact information can be found in [http://labmanager.danchip.dtu.dk/function.php?module=Machine&view=view&mach=313 LabManager]''' | ||