Specific Process Knowledge/Etch/ASE (Advanced Silicon Etch): Difference between revisions
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The deepetch recipe is designed to etch features (with sizes 2 <math>\mu</math>m) in silicon down to a depth that ranges from some 50 microns to hundreds of microns. (If you need to etch less, use shallow or Nanoetches.) It is specified to etch a 50 <math>\mu</math>m wide trench down to a depth of 300 <math>\mu</math>m on a wafer that has a global/local etch density of 10%. | The deepetch recipe is designed to etch features (with sizes 2 <math>\mu</math>m) in silicon down to a depth that ranges from some 50 microns to hundreds of microns. (If you need to etch less, use shallow or Nanoetches.) It is specified to etch a 50 <math>\mu</math>m wide trench down to a depth of 300 <math>\mu</math>m on a wafer that has a global/local etch density of 10%. | ||
The recipe is given below. | |||
{| border="2" cellpadding="2" cellspacing="1" | {| border="2" cellpadding="2" cellspacing="1" | ||
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| 5 s | | 5 s | ||
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<gallery caption="Standardization images of the deepetch recipe" widths="300px" heights="300px" perrow="2"> | <gallery caption="Standardization images of the deepetch recipe" widths="300px" heights="300px" perrow="2"> | ||