Specific Process Knowledge/Etch/ASE (Advanced Silicon Etch): Difference between revisions
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=== Deepetch === | === Deepetch === | ||
The deepetch recipe is designed to etch features (with sizes 2 <math>\mu</math>m) in silicon down to a depth that ranges from some 50 microns to hundreds of microns. (If you need to etch less, use shallow or Nanoetches.) It is specified to etch a 50 <math>\mu</math>m wide trench down to a depth of 300 <math>\mu</math>m on a wafer that has a global/local etch density of 10%. | |||
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