Specific Process Knowledge/Etch/ASE (Advanced Silicon Etch): Difference between revisions
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The process runs for 31 cycles (5:56 mins). The fact that it's Bosch process is clear from the scallops on the sidewalls - one should be able to count 31 of them. | The process runs for 31 cycles (5:56 mins). The fact that it's Bosch process is clear from the scallops on the sidewalls - one should be able to count 31 of them. | ||
<gallery caption="Standardization images of the shallolr recipe" widths="300px" heights="300px" perrow="2"> | <gallery caption="Standardization images of the shallolr recipe" widths="300px" heights="300px" perrow="2"> | ||
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image:jmlshal070921 pos1 50mu_08.jpg|The profile of a 50 <math>\mu</math>m trench | image:jmlshal070921 pos1 50mu_08.jpg|The profile of a 50 <math>\mu</math>m trench | ||
</gallery> | </gallery> | ||
The process is designed to reach 20 <math>\mu</math>m down in a 2 <math>\mu</math>m trench but as is clear from the image of the corresponding 50 <math>\mu</math>m trench, this one is etched deeper. The reason is the so called Aspect Ratio Dependent Etching or ARDE. | |||
=== Deepetch === | === Deepetch === | ||