Specific Process Knowledge/Characterization/KLA-Tencor Surfscan 6420: Difference between revisions

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'''The user manual and contact information can be found in LabManager:'''
'''The user manual and contact information can be found in LabManager:'''


http://labmanager.danchip.dtu.dk/function.php?module=Machine&view=view&page_id=169
http://labmanager.danchip.dtu.dk/function.php?module=Machine&view=view&mach=318


== Process information ==
== Process information ==

Revision as of 12:21, 3 June 2013

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KLA-Tencor Surfscan 6420

The image is from the cleanroom at the place it was refurbish in California.

The KLA-Tencor is a surface analysis instrument for detecting, couting and sizing of particles, i.e. light point defects. A broad range of particles size from 0.15 µm to greater than 3 µm can be measured on a polished silicon surface with or without or epitaxial layers. The particle contamination in thin films like nitride, thermal oxide and polymer or resist can also be inspected. The system will remove small surface roughness so it will not count as particle contaminations.

The user manual and contact information can be found in LabManager:

http://labmanager.danchip.dtu.dk/function.php?module=Machine&view=view&mach=318

Process information

Overview of the performance of the Surfscan 6420 and some process related parameters

Purpose
  • Detecting, counting and sizing of particles (light point defects)
Performance Particles size
  • 0.15 µm to > 3 µm
Througput
  • Up to 100 wafer per hour (200 mm)
Repeatbility
  • Within 1%, 1σ (mean count > 500, 0.204 µm diameter latex spheres)
Process parameter range Process Temperature
  • Room temperature
Substrates Batch size
  • 1-25 100 mm wafers
  • 1-25 150 mm wafers
  • 1-25 200 mm wafers (loader has to be changed)
Substrate materials allowed
  • Silicon
  • Thin layers of oxide, nitride and polymer/resist