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Specific Process Knowledge/Thin film deposition/Deposition of Silicon Oxide/Deposition of Silicon Oxide using LPCVD TEOS: Difference between revisions

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!O<math>_2</math> gas flow [sccm]
!O<math>_2</math> gas flow [sccm]
!PH<math>_3</math> gas flow [sccm]
!PH<math>_3</math> gas flow [sccm]
!TMB
!TMB gas flow [sccm]
!Comments
!Comments
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|Stoichiometric nitride
|standard TEOS recipe
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|"TEOSSLOW"
|"TEOSSLOW"
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|Low stress nitride (silicon rich nitride)
|Recipe used for thick layers
 
This was first tested at DTU Danchip by Matthias Heschel,<br \> ''M. Heschel and S. Bouwstra "Robust, compliant silicon nitride membranes", Proceedings MME '95, Copenhagen, Denmark, September 1995, pp. 84-87''
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