LabAdviser/Technology Research/Nanofabrication of Inductive Components for Integrated Power Supply On Chip: Difference between revisions

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	Power supply in package using TSV-based inductive interposers		Integrated power supplies. (a) Power supply in package using TSV-based inductive interposers that has been developed in this thesis. (b) An outlook of power supply on chip (PwrSoC)using active-passive interposers.