LabAdviser/Technology Research/Nanofabrication of Inductive Components for Integrated Power Supply On Chip: Difference between revisions
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[[image:Untitled4.png| | [[image:Untitled4.png|750px]] | ||
Power supply in package using TSV-based inductive interposers | Power supply in package using TSV-based inductive interposers | ||
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'''Full thesis''': [[:File:1. A4size_HoaThanhLe_Thesis_14.12.2017.pdf]] | '''Full thesis''': [[:File:1. A4size_HoaThanhLe_Thesis_14.12.2017.pdf]] | ||
=Dissemination= | =Dissemination= | ||