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LabAdviser/Technology Research/Technology Development of 3D Silicon Plasma Etching process for Novel Devices and Applications: Difference between revisions

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:Mikro 3W, course no. 33470 (July 2017)
:Mikro 3W, course no. 33470 (July 2017)
==Relevant technology details==
* [[Specific Process Knowledge/Etch/DRIE-Pegasus/Etch high aspect ratio silicon microstructures|Etch high aspect ratio silicon microstructures]]
* [[Specific Process Knowledge/Etch/DRIE-Pegasus/Etch 3 dimensional silicon microstructures|Etch 3 dimensional silicon microstructures]]
* [[Specific Process Knowledge/Etch/DRIE-Pegasus/Etch black silicon|Etch black silicon]]
* [[Specific Process Knowledge/Etch/DRIE-Pegasus/Using OES to monitor etch process|Using OES to monitor etch process]]
* [[Specific_Process_Knowledge/Lithography/EBeamLithography/High resolution patterning with HSQ|High resolution patterning with HSQ]]
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