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[[image:ProcessOIR.png|500px|thumb|Lithography process for Organic Ice Resists]]
[[image:ProcessOIR.png|500px|thumb|Lithography process for Organic Ice Resists]]


The deposition of metal thin-�film structures on dielectric or semiconductor substrates is central for the fabrication of structures and devices having nanoscale characteristic dimension. With the constant miniaturization of the devices and the fabrication of increasingly complex multi-material structures, the interaction between different ultra-thin layers has gained considerable importance in the fi�eld of thin-�film science and technology in recent years. Therefore the characterization of such interactions in a wide range of temperatures and the description of their impact on the chemical composition, morphology and distribution of crystallographic orientations of multilayer thin-�films is of utmost importance.
The deposition of metal thin-film structures on dielectric or semiconductor substrates is central for the fabrication of structures and devices having nanoscale characteristic dimension. With the constant miniaturization of the devices and the fabrication of increasingly complex multi-material structures, the interaction between different ultra-thin layers has gained considerable importance in the field of thin-film science and technology in recent years. Therefore the characterization of such interactions in a wide range of temperatures and the description of their impact on the chemical composition, morphology and distribution of crystallographic orientations of multilayer thin-films is of utmost importance.


This Phd project focuses on the description of the interaction at the nanoscale level between noble metal �films, widely used in different areas of micro- and nanofabrication, and extremely thin �films of reactive transition metals, used to enhance adhesion onto the substrate - and thus referred as "adhesion layers". In particular, the work focused on the study of pure Au �films and Cr/Au and Ti/Au systems, which were analyzed at different temperatures using a spectrum of complementary characterization techniques.
This Phd project focuses on the description of the interaction at the nanoscale level between noble metal �films, widely used in different areas of micro- and nanofabrication, and extremely thin �films of reactive transition metals, used to enhance adhesion onto the substrate - and thus referred as "adhesion layers". In particular, the work focused on the study of pure Au �films and Cr/Au and Ti/Au systems, which were analyzed at different temperatures using a spectrum of complementary characterization techniques.
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