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Specific Process Knowledge/Thin film deposition/Deposition of Silicon Nitride/Deposition of Silicon Nitride using PECVD: Difference between revisions

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Bghe (talk | contribs)
DCH-Employees-701, NLAB-Employees-701, NLAB-LabmanagerAllUsers, Bureaucrats, Administrators
7,324 edits
Line 32: Line 32:
|&plusmn; 1.7%<!-- Unif. [%] -->
|&plusmn; 1.7%<!-- Unif. [%] -->
|157 MPa <!-- Stress [MPa] -->
|157 MPa <!-- Stress [MPa] -->
|<!-- Comments -->
|[[MF_SiN results|more results]]<!-- Comments -->
|40<!-- SiH4 [sccm] -->
|40<!-- SiH4 [sccm] -->
|40<!-- NH3 [sccm] -->
|40<!-- NH3 [sccm] -->
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