Specific Process Knowledge/Thin film deposition/Deposition of Silicon Nitride/Deposition of Silicon Nitride using PECVD: Difference between revisions
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==Recipes on PECVD2 for deposition of silicon nitride and silicon oxynitride == | |||
===Recipes=== | |||
{| border="1" cellspacing="0" cellpadding="7" | |||
|- | |||
|Recipe name | |||
|SiH4 flow [sccm] | |||
|NH3 flow [sccm] | |||
|N2 flow [sccm] | |||
|Pressure [mTorr] | |||
|Power [W] | |||
|Description | |||
|- | |||
|SINSTD80 | |||
|30 | |||
|20 | |||
|1000 | |||
|500 | |||
|80 | |||
| | |||
|- | |||
|SINSTD96 | |||
|30 | |||
|20 | |||
|1000 | |||
|500 | |||
|96 | |||
| | |||
|- | |||
|1SiN | |||
|40 | |||
|20 | |||
|1000 | |||
|700 | |||
|150 | |||
| | |||
|- | |||
|} | |||
===Expected results=== | |||
{| border="1" cellspacing="0" cellpadding="5" | |||
|- | |||
|Recipe name | |||
|Deposition rate [nm/min] | |||
|RI | |||
|Uniformity [%] | |||
|Stress [MPa] | |||
|BHF etch rate [Å/min] | |||
|Comments | |||
|- | |||
|1SiN | |||
| | |||
Deposition rate in the middle of two wafers: '''49nm/min+-1nm/min''' (2015-04-24 BGHE) <br> | |||
In the middel: '''72.6-76.4 nm/min''' (2014-08-13 BGHE) ''Old shower head''<br> | |||
Variation over 3 wafers: '''71.4-78.6 nm/min''' (2014-08-13 BGHE) ''Old shower head'' | |||
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'''~2-4%''' (2015-04-24 BGHE)<br> | |||
'''~5%''' in the middel (4") (2014-08-13 BGHE) ''Old shower head''<br> | |||
'''~10%''' over 3 wafers (2014-08-13 BGHE) ''Old shower head'' | |||
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|SINSTD80 | |||
|68nm/min (2014-07-07 JML)- unstable deposition rate | |||
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|SINSTD96 - unstable deposition rate | |||
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==Recipes on PECVD1 for deposition of silicon nitride and silicon oxynitride. <span style="color:Red">Expired!</span>:PECVD1 has been decommissioned== | ==Recipes on PECVD1 for deposition of silicon nitride and silicon oxynitride. <span style="color:Red">Expired!</span>:PECVD1 has been decommissioned== | ||