Specific Process Knowledge/Thin film deposition/Deposition of Silicon Nitride/Deposition of Silicon Nitride using PECVD: Difference between revisions
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|KOH etch rate [Å/min] | |KOH etch rate [Å/min] | ||
|BHF etch rate [Å/min] | |BHF etch rate [Å/min] | ||
|See more | |||
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|MFSiNLS2 | |MFSiNLS2 | ||
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|~2.1 (''bghe Feb 2016'') | |~2.1 (''bghe Feb 2016'') | ||
|~? | |~? | ||
|[[/PECVD3: Low stress nitride testing|see DOE]] | |||
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|MFSiNLS | |MFSiNLS | ||
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|~2.5 | |~2.5 | ||
|~250 | |~250 | ||
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|LFSiN | |LFSiN | ||
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|~3 | |~3 | ||
|~-630 | |~-630 | ||
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|. | |. | ||
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|~2 | |~2 | ||
|~460 | |~460 | ||
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